Wedge Bonder BJ955/BJ959/BJ985 for Sensors
Providing the ideal bond for manufacturing high-sensitivity sensors.
In the manufacturing of high-sensitivity sensors, precise bonding is required to accurately capture fine signals. Particularly, to maximize the performance of the sensor, it is crucial to eliminate minute misalignments and contact failures in wire bonding as much as possible. Improper bonding can lead to increased noise and signal attenuation, potentially resulting in decreased sensitivity of the sensor. Our fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 achieve reliable bonding necessary for the production of high-sensitivity sensors through high-precision image recognition and stable bonding force. 【Application Scenarios】 - Manufacturing line for high-sensitivity sensors - Bonding of electronic components requiring fine signal transmission - Product development where quality stability is important 【Benefits of Implementation】 - Reduced risk of sensor sensitivity decline - Improved product reliability - Achieving stable productivity
- Company：Hesse Mechatronics Japan Co.,Ltd.
- Price：Other
